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MEMS-SP refers to vertical-spring-type probe cards using a MEMS probe.

  • 01Probe card for logic devices suited for fine pitch bump testing

  • 02Best suited to flip chip wafer testing of microprocessors and SoC devices

  • 03Allows easy single-pin replacement for superior maintenance

  • 04Customizable probe tip configuration

  • 05Can also be used for high-frequency direct docking systems for advanced microprocessors

  • 063D spiral spring probe created using photolithography

  • 07Manufactured using MEMS technology to minimize scatter, providing high precision and highly reliable testing

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