Cantilever Probe Card
Domestic production of cantilever probe
cards ended on 30 September 2023.
MJC Microelectronics(Kunshan)Co., Ltd.,
our China subsidiary, will continue
manufacture of cantilever products in China.
Features
![](https://www.mjc.co.jp/wp-content/themes/adop-mjc/img/products/Cantilever-Probe_image1.jpg)
For Logic device・
Memory device Measurement
Probe cards suited for multiple simultaneous testing
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01Can be used in both high and low temperature environments
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02Needle specification can be adjusted according to pad material and substrate condition
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03Allows shorter lead time and is recommended for research and development situations
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04Low cost of production compared to other vertical probe cards
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05Supports fine pitch
- Logic devices:
- from 30μm
- Memory devices:
- from 50μm
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06Supports LOC and peripheral arrays
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07Needle Specifications for Small Pads (Bow Contact Probe)
- Stress design controls the amount of scrubbing and reduces device pad damage
- Supports pads of thin-film, Low-k, and CUP devices
- Needle specifications are designed according to the pad structure and test conditions
- Card life is extended by preventing the tip blunting
![](https://www.mjc.co.jp/wp-content/themes/adop-mjc/img/products/Cantilever-Probe_image2.jpg)
For LCD Driver Measurement
Probe card suitable for LCD driver IC measurements
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01
Narrowest pitch probe card
Pad pitch: can also be used for 25 μm
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02Low needle pressure contact reduces bump damage
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03Supports multi DUT
![](https://www.mjc.co.jp/wp-content/themes/adop-mjc/img/products/Cantilever-Probe_image3.jpg)
For Low Current Measurement
This type of probe card for low current measurement has a resolution of the order of 10fA
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01Resolution on the order of 10fA
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02Leakage current can be measured even in the R&D scene
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03Can be used for Keysight Technologies' tester series 4070 and 4080