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Semiconductor Division
FPD Division

Semiconductor Division

Our product lineup for the semiconductor manufacturing process includes probe cards for testing the electrical properties of wafers, testing equipment called IC testers and test sockets for property testing after packaging, as well as a wafer prober, which is used for evaluation and analysis during R&D of devices. As the functionality and diversity of semiconductors advances, we are supporting the enhancement of productivity and quality with our highly reliable testing and measurement technologies.

Applied Product Field

PC
Smart Phone
Server
Automobile
Game

Semiconductor Manufacturing Process

Select a process to see details

Wafer manufacturing
Board wiring process
Wafer testing
Mounting and assembly process
Final inspection

IC* chips (smiconductors) are primarily manufactured on ultra-high purity monocrystaline silicon wafers.* IC: integrated circuit

A circuit pattern is printed on the wafer and a fine electronic circuit is formed by injecting ions.

Semiconductor devices on wafers are tested for electrical properties.

The IC chips are cut from the wafer every few millimeters and encapsulated in a package using a resin mold.

The package IC chip receives a rigorous inspection for performance and reliability using a test socket.

Products used in this process

Package Probe

FPD Division

In the FPD field we offer products which are used for testing the electrical properties of flat panel displays (FPDs), and probe units that send electrical signals to test panels. As FPDs become larger with higher definition and more versatile, we are providing optimal testing solutions and contributing to productivity gains.