Full-Automatic Prober for One Touch Down (for 12-inch wafer)
An automatic prober for one-touchdown with 12-inch wafer.
One-touchdown with the entire wafer
The adoption of automatic probe card balancing, standard mark alignment, and a high-rigidity stage allows one-touchdown of an entire 12-inch wafer.
- Eliminates the need for probe index, which leads to substantial test cycle time reduction
- Minimizes the range of chuck movement, which reduces the footprint in the clean room.
Allows proposals on total solutions including a probe card and a tester
- Test path optimization helps achieve highly accurate, high-speed testing.
- Centralization of after-sales service helps improve operation and management efficiency.
MJC will propose optimized test systems according to the application and usage environment
Model BP-3000 Full-Automatic Prober for One-Touchdown (for 12-inch wafer)
|Stage travel||X: ±30mm Y: ±30mm|
|Accuracy in the positioning stage||5μm or less|
|Repeat accuracy in the positioning stage||±1μm|
|Maximum load capacity||2940N (300kgf)|
|External dimensions (WxDxH)||910mm×1,250mm×970mm|