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Exhibition	SEMICON Southeast Asia 2019
Exhibit Date	May 7; Tuesday - 9; Thursday, 2019
Venue	The Malaysia International Trade and Exhibition Centre (MITEC), Malaysia
Booth No.	517
Products on display	Package Probe (Test Sockets)
Information	URL http://www.semiconsea.org/

Exhibition	Semiconductor Wafer Test Conference (SWTEST) 2019
Exhibit Date	June 2; Sunday - 5; Wednesday, 2019
Venue	Rancho Bernardo Inn Resort & Spa, San Diego, California, USA
Booth No.	Bernardo Hall, #102
Products on display	Advanced Probe Cards; MEMS-SP for Flip Chip Probe Card for Logic Device U-Probe for DRAM Package Probe (Test Sockets)
Information	URL http://www.swtest.org/

Event Calendar

2019

Date	Name of exhibition	Venue	Products on display
December 11-13	SEMICON Japan 2019	Tokyo Big Sight, Japan	Probe Card Package Probe (Test Sockets) Tester Wafer Prober
September 18-20	SEMICON TAIWAN 2019	Taipei Nangang Exhibition Center, Taiwan	Probe Card Package Probe (Test Sockets) Tester Wafer Prober
Jun 2-5	Semiconductor Wafer Test Conference (SWTEST) 2019	Rancho Bernardo Inn San Diego, California, U.S.A.	Advanced Probe Card; MEMS-SP for Flip Chip / Probe Card for Logic Devices / U-Probe for DRAM Package Probe (Test Sockets)
May 7-9	SEMICON Southeast Asia 2019	The Malaysia International Trade and Exhibition Centre (MITEC), Malaysia	Package Probe (Test Sockets)
March 20-22 Ended	SEMICON CHINA 2019	Shanghai New International Expo Centre, China	Advanced Probe Card; MEMS-SP for flip chip / Vertical-Probe (Needle Type) / U-Probe for DRAM Cantilever Type Probe Card; for Small Scrub Marks / LCD-Driver Package Probe (Test Sockets); J-Contacts / BeeContacts Logic Tester Wafer Prober; for Analysis / for Power Device
March 3-6 Ended	TestConX 2019	Hilton Phoenix East/Mesa Hotel, AZ, U.S.A.	Package Probe (Test Sockets)

2018

Date	Name of exhibition	Venue	Products on display
December 12-14	SEMICON Japan 2018	Tokyo, Japan	Advanced Probe Card; MEMS-SP for Flip Chip / U-Probe for DRAM / Vertical-Probe (Needle Type) Cantilever Type Probe Card; for Small Scrub Marks Package Probe (Test Sockets); J-Contacts / BeeContacts Logic Tester Wafer Prober; for Analysis/ for Power Device
October 18-19	Semiconductor Wafer Test Workshop Asia (SWTest Asia 2018)	Hsinchu, Taiwan	Probe Cards for Logic Devices; MEMS-SP / Vertical-Probe (Needle Type) / Cantilever Type Probe Card for LCD-Driver
September 5-7	SEMICON TAIWAN 2018	Taipei, Taiwan	Advanced Probe Card; MEMS-SP for Flip Chip / U-Probe for DRAM / Vertical-Probe (Needle Type) Cantilever Type Probe Card; for Small Scrub Marks / LCD-Driver Package Probe (Test Sockets); J-Contacts / BeeContacts Tester; µTAT5100 / µTAT5300 Wafer Prober; for Analysis / Power Device
Jun 27-29	BIO tech 2018	Tokyo, Japan	Ultrafine process technologies
June 26	19th Korea Semiconductor Test Conference	Seoul, Korea	Advanced Probe Card; MEMS-SP for Flip Chip / U-Probe for DRAM
Jun 6-8	WIRE Japan Show2018 (Electric wire, Cable, and Connector Exhibition) in The Total Solution Exhibition for Electronic Equipment	Tokyo, Japan	Probe Card for next generation devices
Jun 3-6	Semiconductor Wafer Test Workshop(SWTW2018)	California, U.S.A.	Advanced Probe Card; MEMS-SP for Flip Chip / U-Probe for DRAM / Probe Card for Logic Devices Package Probe (Test Sockets); J-Contacts / BeeContacts
May 22-24	SEMICON Southeast Asia 2018	Kuala Lumpur, Malaysia	Advanced Probe Card; MEMS-SP for Flip Chip / U-Probe for DRAM / Vertical-Probe (Needle Type) Package Probe (Test Sockets); J-Contacts / BeeContacts
March 14-16	SEMICON CHINA 2018	Shanghai, China	Advanced Probe Card; MEMS-SP for Flip Chip / U-Probe for DRAM / Vertical-Probe (Needle Type) Cantilever Type Probe Card; for Small Scrub Marks / LCD-Driver Package Probe (Test Sockets); J-Contacts / BeeContacts Tester; µTAT5100 / µTAT5300 Wafer Prober; for Analysis / Power Device

2017

Date	Name of exhibition	Venue	Products on display
December 13-15	SEMICON Japan 2017	Tokyo, Japan	Advanced Probe Card; MEMS-SP for Flip Chip / U-Probe for DRAM / Vertical-Probe (Needle Type) Cantilever Type Probe Card; for Small Scrub Marks Package Probe (Test Sockets); J-Contacts / BeeContacts Tester; µTAT5300 Wafer Prober; for Analysis / for Power Device
September 13-15	SEMICON TAIWAN 2017	Taipei, Taiwan	Advanced Probe Card; MEMS-SP for Flip Chip / U-Probe for DRAM / Vertical-Probe (Needle Type) Cantilever Type Probe Card; for Small Scrub Marks Package Probe (Test Sockets); J-Contacts / BeeContacts Tester; µTAT5300 Wafer Prober; for Analysis / for Power Device
June 27	18th Korea Semiconductor Test Conference	Seoul, Korea	Advanced Probe Card; MEMS-SP for Flip Chip / U-Probe for DRAM / Vertical-Probe (Needle Type) Package Probe (Test Sockets); J-Contacts / BeeContacts
June 4-7	Semiconductor Wafer Test Workshop (SWTW2017)	California, U.S.A.	Advanced Probe Card; MEMS-SP for Flip Chip / U-Probe for DRAM / Probe Card for Logic Devices Package Probe (Test Sockets); J-Contacts / BeeContacts
March 14-16	SEMICON CHINA 2017	Shanghai, China	Advanced Probe Card; MEMS-SP for Flip Chip / U-Probe for DRAM / Vertical-Probe (Needle Type) Package Probe (Test Sockets); J-Contacts / BeeContacts
March 5-8	BiTS EXPO 2017 (Burn-in & Test Strategies Workshop)	Arizona, U.S.A.	Package Probe (Test Sockets); J-Contacts / BeeContacts
February 15-17	nano tech 2017	Tokyo, Japan	Ultrafine process technologies