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Exhibition	SEMICON Japan 2021 Hybrid
Exhibit Date	December 15; Wednesday - 17; Friday, 2021
Venue	Tokyo Big Sight, Japan East Hall
Booth No.	2421
Products on display	Advanced Probe Card; MEMS-SP for Flip Chip / Vertical-Probe (Needle Type) / U-Probe for DRAM Package Probe (Test Sockets); J-Contacts / BeeContacts Custom Tester Wafer Prober
Information	URL https://www.semiconjapan.org/en/

Exhibition	SEMICON TAIWAN 2021
Exhibit Date	December 28; Tuesday - 30; Thursday, 2021
Venue	Taipei Nangang Exhibition Center
Booth No.	K2688
Products on display	Advanced Probe Card; MEMS-SP for flip chip / Vertical-Probe (Needle Type) / U-Probe for DRAM Package Probe (Test Sockets) Custom Tester Wafer Prober
Information	URL http://www.semicontaiwan.org/en/

Event Calendar

2021

Date	Name of exhibition	Venue	Products on display
December 15-17	SEMICON Japan 2021 Hybrid	Tokyo Big Sight, Japan	Advanced Probe Card; MEMS-SP for Flip Chip / Vertical-Probe (Needle Type) / U-Probe for DRAM Package Probe (Test Sockets); J-Contacts / BeeContacts Custom Tester Wafer Prober
December 28-30	SEMICON TAIWAN 2021	Taipei Nangang Exhibition Center, Taiwan	Advanced Probe Card; MEMS-SP for Flip Chip / Vertical-Probe (Needle Type) / U-Probe for DRAM Package Probe (Test Sockets) Custom Tester Wafer Prober
August 30-September 1 Ended	Semiconductor Wafer Test Conference (SWTEST) 2021	Rancho Bernardo Inn San Diego, California & Online	Advanced Probe Card; MEMS-SP for Flip Chip / Probe Card for Logic Devices / U-Probe for DRAM
August 23-27 Ended	SEMICON Southeast Asia 2021	Online	Package Probe (Test Sockets); J-Contacts
May 3-7 Ended	TestConX 2021	Online	Package Probe (Test Sockets); J-Contacts

2020

Date	Name of exhibition	Venue	Products on display
December 14-17	SEMICON JAPAN VIRTUAL	Online	Advanced Probe Card; MEMS-SP for Flip Chip / Vertical-Probe (Needle Type) / U-Probe for DRAM Package Probe (Test Sockets); J-Contacts / BeeContacts Custom Tester Wafer Prober
November 11	SWTEST UNTETHERED 2020	Online	Advanced Probe Card; MEMS-SP for flip chip / Probe Card for Logic Devices / U-Probe for DRAM
September 23-25	SEMICON TAIWAN 2020	Taipei	Advanced Probe Card; MEMS-SP for flip chip / Vertical-Probe (Needle Type) / U-Probe for DRAM Cantilever Type Probe Card; for Small Scrub Marks / LCD-Driver Package Probe (Test Sockets) Custom Tester Wafer Prober

2019

Date	Name of exhibition	Venue	Products on display
December 11-13	SEMICON Japan 2019	Tokyo, Japan	Advanced Probe Card; MEMS-SP for Flip Chip / Vertical-Probe (Needle Type) / U-Probe for DRAM Cantilever Type Probe Card; for Small Scrub Marks Package Probe (Test Sockets); J-Contacts / BeeContacts Logic Tester Wafer Prober
October 17-18	Semiconductor Wafer Test Asia 2019	Hsinchu, Taiwan	Advanced Probe Card; MEMS-SP for Flip Chip / Vertical-Probe (Needle Type) Package Probe (Test Sockets)
September 18-20	SEMICON TAIWAN 2019	Taipei, Taiwan	Advanced Probe Card; MEMS-SP for Flip Chip / Vertical-Probe (Needle Type) / U-Probe for DRAM Cantilever Type Probe Card; for Small Scrub Marks / LCD-Driver Package Probe (Test Sockets) Logic Tester Wafer Prober
June 25	20th Korea Semiconductor Test Conference	Seoul, Korea	Advanced Probe Card; MEMS-SP for Flip Chip / Probe Card for Logic Devices / U-Probe for DRAM
Jun 2-5	Semiconductor Wafer Test Conference (SWTEST) 2019	California, U.S.A.	Advanced Probe Card; MEMS-SP for Flip Chip / Probe Card for Logic Devices / U-Probe for DRAM Package Probe (Test Sockets)
May 7-9	SEMICON Southeast Asia 2019	Kuala Lumpur, Malaysia	Package Probe (Test Sockets)
March 20-22	SEMICON CHINA 2019	Shanghai, China	Advanced Probe Card; MEMS-SP for Flip Chip / Vertical-Probe (Needle Type) / U-Probe for DRAM Cantilever Type Probe Card; for Small Scrub Marks / LCD-Driver Package Probe (Test Sockets); J-Contacts / BeeContacts Logic Tester Wafer Prober; for Analysis / for Power Device
March 3-6	TestConX 2019	Arizona, U.S.A.	Package Probe (Test Sockets)