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Exhibition	SEMICON Japan 2018
Exhibit Date	December 12;Wednesday - 14;Friday
Venue	Tokyo Big Sight, Japan
Booth No.	2021
Products on display	Advanced Probe Card; MEMS-SP for Flip Chip / U-Probe for DRAM / Vertical-Probe (Needle Type) Cantilever Type Probe Card; for Small Scrub Marks Package Probe (Test Sockets); J-Contacts / BeeContacts Logic Tester Wafer Prober; for Analysis/ for Power Device
Information	URL http://www.semiconjapan.org/en/

Event Calendar

2018

Date	Name of exhibition	Venue	Products on display
December 12-14	SEMICON Japan 2018	Tokyo Big Sight, Japan	Advanced Probe Card; MEMS-SP for Flip Chip / U-Probe for DRAM / Vertical-Probe (Needle Type) Cantilever Type Probe Card; for Small Scrub Marks Package Probe (Test Sockets); J-Contacts / BeeContacts Logic Tester Wafer Prober; for Analysis/ for Power Device
October 18-19 Ended	Semiconductor Wafer Test Workshop Asia (SWTest Asia 2018)	Sheraton Hsinchu Hotel Zhubei City, Taiwan	Probe Cards for Logic Devices; MEMS-SP / Vertical-Probe (Needle Type) / Cantilever Type Probe Card for LCD-Driver
September 5-7 Ended	SEMICON TAIWAN 2018	Taipei Nangang Exhibition Center, Taiwan	Advanced Probe Card; MEMS-SP for Flip Chip / U-Probe for DRAM / Vertical-Probe (Needle Type) Cantilever Type Probe Card; for Small Scrub Marks / LCD-Driver Package Probe (Test Sockets); J-Contacts / BeeContacts Tester; µTAT5100 / µTAT5300 Wafer Prober; for Analysis / Power Device
Jun 27-29 Ended	BIO tech 2018	Tokyo Big Sight, Japan	Ultrafine process technologies
June 26 Ended	19th Korea Semiconductor Test Conference	Seoul, Korea	Advanced Probe Card; MEMS-SP for Flip Chip / U-Probe for DRAM
Jun 6-8 Ended	WIRE Japan Show2018 (Electric wire, Cable, and Connector Exhibition) in The Total Solution Exhibition for Electronic Equipment	Tokyo Big Sight, Japan	Probe Card for next generation devices
Jun 3-6 Ended	Semiconductor Wafer Test Workshop(SWTW2018)	Rancho Bernardo Inn San Diego, California, U.S.A.	Advanced Probe Card; MEMS-SP for Flip Chip / U-Probe for DRAM / Probe Card for Logic Devices Package Probe (Test Sockets); J-Contacts / BeeContacts
May 22-24 Ended	SEMICON Southeast Asia 2018	The Malaysia International Trade and Exhibition Centre (MITEC), Malaysia	Advanced Probe Card; MEMS-SP for Flip Chip / U-Probe for DRAM / Vertical-Probe (Needle Type) Package Probe (Test Sockets); J-Contacts / BeeContacts
March 14-16 Ended	SEMICON CHINA 2018	Shanghai New International Expo Centre, China	Advanced Probe Card; MEMS-SP for Flip Chip / U-Probe for DRAM / Vertical-Probe (Needle Type) Cantilever Type Probe Card; for Small Scrub Marks / LCD-Driver Package Probe (Test Sockets); J-Contacts / BeeContacts Tester; µTAT5100 / µTAT5300 Wafer Prober; for Analysis / Power Device

2017

Date	Name of exhibition	Venue	Products on display
December 13-15	SEMICON Japan 2017	Tokyo, Japan	Advanced Probe Card; MEMS-SP for Flip Chip / U-Probe for DRAM / Vertical-Probe (Needle Type) Cantilever Type Probe Card; for Small Scrub Marks Package Probe (Test Sockets); J-Contacts / BeeContacts Tester; µTAT5300 Wafer Prober; for Analysis / for Power Device
September 13-15	SEMICON TAIWAN 2017	Taipei, Taiwan	Advanced Probe Card; MEMS-SP for Flip Chip / U-Probe for DRAM / Vertical-Probe (Needle Type) Cantilever Type Probe Card; for Small Scrub Marks Package Probe (Test Sockets); J-Contacts / BeeContacts Tester; µTAT5300 Wafer Prober; for Analysis / for Power Device
June 27	18th Korea Semiconductor Test Conference	Seoul, Korea	Advanced Probe Card; MEMS-SP for Flip Chip / U-Probe for DRAM / Vertical-Probe (Needle Type) Package Probe (Test Sockets); J-Contacts / BeeContacts
June 4-7	Semiconductor Wafer Test Workshop (SWTW2017)	California, U.S.A.	Advanced Probe Card; MEMS-SP for Flip Chip / U-Probe for DRAM / Probe Card for Logic Devices Package Probe (Test Sockets); J-Contacts / BeeContacts
March 14-16	SEMICON CHINA 2017	Shanghai, China	Advanced Probe Card; MEMS-SP for Flip Chip / U-Probe for DRAM / Vertical-Probe (Needle Type) Package Probe (Test Sockets); J-Contacts / BeeContacts
March 5-8	BiTS EXPO 2017 (Burn-in & Test Strategies Workshop)	Arizona, U.S.A.	Package Probe (Test Sockets); J-Contacts / BeeContacts
February 15-17	nano tech 2017	Tokyo, Japan	Ultrafine process technologies

2016

Date	Name of exhibition	Venue	Products on display
December 14-16	SEMICON Japan 2016	Tokyo, Japan	Advanced Probe Card; MEMS-SP for Flip Chip / U-Probe for DRAM / Vertical-Probe (Needle Type) Cantilever Type Probe Card; for Small Scrub Marks Package Probe (Test Sockets); J-Contacts / BeeContacts Tester; µTAT5100 / µTAT5300 Wafer Prober; for Analysis / for Power Device
June 21	17th Korea Semiconductor Test Conference	Seoul, Korea	Advanced Probe Card; MEMS-SP for Flip Chip / U-Probe for DRAM / Vertical-Probe (Needle Type) Package Probe (Test Sockets); J-Contacts / BeeContacts
June 5-8	Semiconductor Wafer Test Workshop (SWTW2016)	California, U.S.A.	Advanced Probe Card; MEMS-SP for Flip Chip / U-Probe for DRAM / Probe Card for Logic Devices Package Probe (Test Sockets); J-Contacts / BeeContacts
March 15-17	SEMICON CHINA 2016	Shanghai, China	Advanced Probe Card; MEMS-SP / U-Probe for DRAM / Vertical-Probe (Needle Type) Package Probe (Test Sockets); J-Contacts / BeeContacts
March 6-9	BiTS EXPO 2016 (Burn-in & Test Strategies Workshop)	Arizona, U.S.A.	Package Probe (Test Sockets); J-Contacts / BeeContacts
January 27-29	nano tech 2016	Tokyo, Japan	Ultrafine process technologies