Wafer Testing is the one of semiconductor testing process, in wafer testing, three items: Tester, Prober, and Probe card are necessary in order to examine electrical character.
Since every semiconductor manufacturer always focuses on high productivity, therefore, simultaneous testing that testing IC chip as much as possible at a time is required. As a result, every manufacturer looks for method or system to realize simultaneous testing. Ultimate technique and system to realize this purpose is to execute testing in full-wafer at a time (wafer batch contact).
*Simultaneous testing of IC chip is called multi-die testing.
"Full Contact Test System" is providing the ultimate solution.
The optimization of three items is important in "Full Contact Test System", therefore, in order to provide optimized testing environment for customer, MJC develop & organize Three-In-One system containing those key items; Tester, Prober, and Probe Card.
Total Solution MJC provides is to create & propose highly reliable testing environment which is required by semiconductor manufacturers.
This system is especially optimized for DFT such as Memory Device Test and Wafer-Burn-In Test, which mount & feature BIST (Built In Self Test),.