Advanced Probe Card is called 'Next generation type' and it has the newest technology with higher throughput, finer pitch, higher density, and higher frequency compare to the existing cantilever type. Let MJC introduce the advanced probe card developed with stand-alone technology.
The combination of MEMS Probe 'micro canti lever' and MLS (Multi Layer Substrate) enable the probe card to Test full wafer size. For NAND FLASH (*Please see the Chart One left side) MJC released the Probe Card at 1st in the world to make the contact 12 inch wafer by 1TD (Touch Down means the necessary contact time to test one wafer.), for DRAM, MJC released the DUT layout which is capable to reduce TD at maximum. The probe area is equivalent to wafer size, U-Probe DUT layout allows probes to contact anywhere on a wafer. U-probe Crescent (*Please see Chart One right side) has Crescent shaped DUT layouts and it has proven to be the most spatially efficient arrays to achieve maximum tester resource utilization.
Efficient DUT layouts using wafer scale probing achieves, 1. Numbers of TD's per wafer is reduced and 2. Scrub marks are uniform on all locations throughout the entire wafer, this improves test yield through uncompromised electrical contact integrity.
Chart One: U-Probe (Left: for NAND FLASH / Right: Crescent Type for DRAM)
S-probe is one of the MJC advance probe cards. This card is manufactured by making use of the photo lithography & etching technology which is used for micro fabrication like manufacturing IC (Integrated Circuit). This is the reason why is it is called lithography type.
The probes are capable to contact on bonding pads located by fine pitch and leave less damage by lower contact force. It is suitable for multi measurement. MJC has LCD-S and Logic-S as products line up. LCD-S is suitable for LCD driver IC measurement which requires fine pith. Logic-S is suitable for Logic device, SoC which is expected to be demanded in the future.
Chart Two: S-Probe (Left: LCD-S / Right: Logic-S)
Vertical-Probe is one of the advanced cards. It is suitable for multi measurement such as peripheral pad layout and device area allay (*Please see Chart Three) which was not suitable for existing (canti lever).
Needles are assembled in vertical against PCB. This is the reason why this card is called Vertical Probe Card. Because the needle is short and contact on device in vertical, it is suitable for testing small pads, low voltage & high frequency device. It is capable of multi measurement.
Chart Three: Pad layout on LSI
Chart Four: Vertical-Probe