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- Probe Card
- Wafer Tester
- Wafer Prober
- Package Probe(Test Socket)
What is the Total Solution of Full Contact Test System?
- mTAT Series
- Enable Low Cost with best hardware configuration for device needs such as DFT (BIST integrated device). Enable Low Footprint with All-in-one test head structure adopting high level Integrated packaging of test circuit. Line up engineering testers for development & failure analysis and it contributes to reduce time of device programming and failure analysis on development.
- Full Contact Test System
- Full Contact Test System provides the solution with combination of Full Wafer Prober, Test System and Full Wafer Probe Card in order to reduce the test cost & enhance productivity. The Concept of development is to pursue the reduction of test system cost, to improve the reliability of testing and to unify pre & after service.
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