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Probe Card

U-Probe
U-Probe for Multi-die Test of Memory IC
Probe card for multi-die testing of a memory device using our original "micro-cantilever" probe technique, to which MEMS technique has been applied, and "MLS (multi-layer substrate) production technique. This supports contact on large-sized probe areas and achieves 8"/12" full wafer contact
Vertical-Probe
Vertical-Probe Needle Type
Probe card suitable for multi-die test of devices with peripheral pads.
Vertical-Probe for Bumped IC
Vertical-Probe Spring Type
Probe card suitable for area array pad test.
64DUTs Multi-Die
64DUTs Multi-Die
For 64-DUT simultaneous measurement. Supports LOC layout DRAM product.
Probe Card for RF devices
Probe Card for RF devices
For RF testing with coaxial probe needles. Available for the frequency up to GHz level.
Fine Pitch
Fine Pitch
Supports fine pitch down to 20um.
LCD Driver
LCD Driver
For LCD Driver IC supporting Au bump fine pitch. Enables to test 1x2 and 2x1 DUT layouts by Multi Square method.
In addition to conventional needle material ReW, new material is provided to support stable and reduce cleaning frequency.
Multi Square Probe Card
Multi Square Probe Card
For multi-die testing of devices with pads at four edges. Enables to test 2x2, 1x8 etc. DUT layouts.
Low Leakage
Low Leakage
For parametric test that can measure 10fA order ultra low current. Applicable to Agilent Testers 4071, 4072, 4073 etc.

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